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C1002 AD8531AR MS4208L6 2SC5097 A1695 BC846B 25A12 MJD31T4G
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 ET50N06
50 Amps60Volts N-CHANNEL MOSFET
DESCRIPTION
The ET50N06 is a N-Channel enhancement MOSFET and is designed to have better characteristics, such as superior switching performance, and withstand high energy pulse in the avalanche and commutation mode. These devices are well suited for low voltage applications such as automotive DC/DC converters, and high efficiency switching for power management in portable and battery operated products.

FEATURES
RDS(ON)=0.023@VGS=10V Low gate charge(typical 31nC) Low reverse transfer capacitance(CRSS=typical 80pF) Fast switching capability Avalanche energy specified Improved dv/dt capability,high ruggedness
SYMBOL
ABSOLUTE MAXIMUM RATINGS(Tc=25,unless
PARAMETER Drain-Source Voltage Gate-Source Voltage SYMBOL VDSS VGSS
otherwise specified)
UNIT V V 60
PATINGS
20
1
BEIJING ESTEK ELECTRONICS CO.,LTD
ET50N06
Drain Currenet Continuous Drain Current Pulsed(Note 1) Avalanche Energy Repetitive(Note 1) Single Pulse(Note 2) Peak Diode Recovery dv/dt(Note 3) Total Power Dissipation Operation Junction Temperature Storage temperature Tc=25 Derate above 25 TJ TSTG Tc=25 Tc=100 IDP EAR EAS dv/dt PD ID 50 35 200 13 480 7.0 120 0.8 -55 to+150 -55~+150 A A A mJ mJ v/ns W w/
THERMAL DATA
PARAMETER Thermal Resistance Junction-Ambient Thermal Resistance Junction-Case Thermal Resistance Case-Sink SYMBOL JA JC CS TYP 0.5 MAX 62.5 1.24 UNIT /W /W /W
ELECTRICAL CHARACTERISTICSTJ=25,unless Otherwise specified.
PARAMETER SYMBOL TEST CONDITIONS MIN TYP MAX UNIT
Off Characteristics Drain-Source Breakdown Voltage Zero Gate Voltage Drain Current Gate-Body Leakage Current Breakdown Voltage Temperature On Characteristics Gate Threshold Voltage Static Drain-Source On-Resistance Dynamic Characteristics Input Capacitance Output Capacitance Reverse Transfer Capacitance CISS COSS CRSS VDS=25V,VGS=0V,f=1MHZ 900 430 80 1220 550 100 pF pF pF VGS(TH) RDS(ON) VDS=VGS, ID=250A VDS=10V,ID=25A 2.2 0.019 3.8 0.023 V Forward Reverse BVDSS/TJ BVDSS IDSS VGS=0V,ID=250A VDS=60V,VGS=0V VDS=48V,TC=150 IGSS VGS=20V,VDS=0V VGS=-20V,VDS=0V ID=250A 0.06 60 1 10 100 -100 V A A nA nA V/
ELECTRICAL CHARACTERISTICS(Cont.)
SYMBOL TEST CONDITIONS MIN TYP MAX UNIT
PARAMETER Switching Characteristics Turn-On Delay Time Rise Time Turn-Off Delay Time Fall Time Total Gate Charge Gate-Source Charge Gate-Drain Charge Drain-Source Diode Characteristics Drain-Source Diode Forward Voltage Continuous Drain-Source Current Pulsed Drain-Source Current Reverse Recovery Time
tD(ON) tR tD(OFF) tF
QG QGS QGD
40 VDD=30V,ID=25A,RG=50 (Note4,5) 100 90 80 30 VDS=48V,VGS=10V,ID=50A(Note4,5) 9.6 10
60 200 180 160 40 -
ns ns ns ns nC nC nC
VSD ISD ISM
VGS=0V,ISD=50A
1.5 50 200 54
V A A ns
tRR
2
BEIJING ESTEK ELECTRONICS CO.,LTD
ET50N06
Reverse Recovery Charge QRR 81 nC
Note:1.Repetitive Rating: Pulse width limited by maximum junction temperature 2.L=5.6mH,IAS=50A,VDD=25V,RG=0,Starting TJ=25 3.ISD50A,di/dt300A/s,VDDBVDSS, Starting TJ=25 4.Pulse Test: Pulse Width300s,Duty Cycle2% 5. Essentially Independent of Operating Temperature
TYPICAL CHARACTERISTICS
3
BEIJING ESTEK ELECTRONICS CO.,LTD
ET50N06
4
BEIJING ESTEK ELECTRONICS CO.,LTD


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